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| PL IA Features Applications NT DC to 3.0 GHz Flanged model Low VSWR Beryllium Oxide ceramic *R oH S CO M High power RF transmission CHF9838CBF Series 250 W Power RF Flanged Chip Termination General Specifications Substrate ...........................................Beo Resistive Film...........................Thick Film Tab .......................................................Ag Cover Substrate.............................AL203 Mounting Flange ..........Cu plated with Ni Resistance........................................50 Tolerance .........................................5 % Packaging .............................60 pcs./tray Absolute Ratings Power.............................................250 W Frequency ...................................3.0 GHz VSWR ...............................1.25 Maximum Characteristic Curve 300 250 Power (Watts) 200 150 100 50 0 -55 0 100 150 Heat Sink Temperature (C) Product Dimensions 24.77 (0.975) 18.42 (0.725) 9.53 (0.375) 3.18 (0.125) 2.79 (0.11) 4.92 MAX (0.1937) 9.53 (0.375) 6.5 (0.256) DIMENSIONS = MILLIMETERS (INCHES) 3.0 (0.118) 3.5 (0.1377) 3.79 (0.149) 0.1 (0.0039) Reliable Electronic Solutions Asia-Pacific: Tel: +886-2 2562-4117 Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 Fax: +1-951 781-5700 www.bourns.com How To Order CHF 9838 C B F 500 L Model Size Version Substrate Mount F = Flange Value 500 = 50 Ohm Function L = Termination *RoHS Directive 2002/95/EC Jan 27 2003, including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. COPYRIGHT(c) 2005, BOURNS, INC. LITHO IN U.S.A., SR0502 05/05 |
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